Metal Clad PCB




  • Layer of electrically isolating alumina (Al2O3) formed on an aluminium base
  • Ultra-thin layer of adhesive to attach a copper foil circuit trace
  • Composite thermal conductivity: 120 W/m 
  • Operating temperature: 130 °C 


  • Chip Scale Packaged (CSP) modules
  • Chip-on-Board LED (COB LED) modules
  • High density LED modules
  • Automotive Lighting modules
  • Horticultural lighting
  • Power semiconductors
Item Value Unit Condition Method
Thermal MCPCB thermal conductivity 115 W / mK ASTM E1461
Dielectric thermal conductivity 7.3 W / mK Calculated
MCPCB thermal resistance 0.31 ° 2 / W MET-5.4-01-40000
MCPCB thermal impedance 0.27 °C / W Calculated for parallel heat flux through 100mm2
Dielectric thermal resistance 10 um 0.010 ° 2 / W Calculated
Dielectric thermal resistance 30 um 0.041 ° 2 / W Calculated
Maximum operating temperature 130 °C UL746
Dielectric glass transition temperature n/a Tg Not applicable to a nano grain ceramic layer
Flammability V-0 UL94
Electrical Dielectric constant at 1 MHz 430 pF/cm2 Parallel plate
Capacitance 7.6 RCL meter
Volume resistivity dry 1.205 E15 Ω-cm ASTM D257
Volume resistivity wet 6.237 E15 Ω-cm ASTM D257
Breakdown voltage >2,120 (1,500) Vdc (Vac) IPC-TM-650 (IPC-TM-650
Comparative tracking index 390 (PLC 2) Vdc UL 746A
Mechanical Peel strength > 1 N / mm IPC-TM-650 2.4.8

*Nanotherm LC 10 * 1.0mm aluminium, ENEPIG on 1oz copper. Assumes 45 ℃ heat spreading, ignores interface resistances. 

Ref. Property / Material Parameter
1 Sidedness
Circuit layout Single-sided only
2 Electrical Withstand
2,120V DC (equivalent to 1,500V AC)
3 Aluminium alloy Area
285 x 437 mm
Thickness 1.0, 1.5 mm (standard), custom to max 3.2mm
Alloy 6082-T6 (standard), 6061
Warp(bow and twist) 0.50% L
Underside finish Brushed
4 Copper tracking Thickness 35um (10z, standard) 70um(2 Oz)
Track width
150 um
200 um
Gap (space) between tracks
150 um
200 um
Organic solderability preservativeOSP,ENIG (typ. 3 um Ni, 0.1 um Au)ENEPIG (typ. 3 um Ni, 0.1 um Pd, 0.1 um Au)Immersion silverIAG(typ. 0.15 um)
Cut-back from routed/v-score edge or mechanical feature 250 um
Cut back from punched edge Same as aluminium thickness
Cut back for 1.5KV AC creepage 1.45 mm
Mechanical registration to outline +/-50 um
Minimum character height for etched nomenclature 1.5 mm
5 Solder mask Type LEW-3 EMP110
Colour White LED white, white, black, green, red, blue
Thickness 20 um +/-5 um permissible range 10-50 um 10-20 um
Line width

125 um (1oz copper)

150um (2oz copper)

75 um (1 oz copper)

100 um (2 oz copper)

Minimum cut back from routed/v-score edge or mechanical feature 100 um

50 um (1 oz copper)

75 um (2 oz copper)

Relief to copper 100 um
Solder mask overlap on copper pad (optional) 250 um
Cut back from punched edge Same as aluminium thickness
Character height / line width in solder mask 500/200 um
6 Ident / legend / silkscreen Colour Black, yellow, white
Width 150 um
Gap 150 um
Character height 1.5 mm
Cut back from pad, routed/v-score edge or mechanical feature 200 um
Ident on pad Not permitted
7 Marking UL Restricted permutations*
Makers Yes
Date / lot To panel level
8 Holes

1.2 mm in <1.5 mm aluminium

 1.5 mm in 1.5 mm aluminium

 1.8 mm in >1.5mm aluminium

Registration to copper
+/-150 um
9 Slots Trench width 2.0 mm
Internal radius 0.8 mm
Registration to copper +/-150um
10 V-score V-cut angle 30°
Web thickness

200 um +/-100 um (1.0 mm aluminium)

300 um +/-100 um (1.5 mm aluminium)

Copper cut back from centre line 1.5mm
Solder mask cut back from centre line 1.3 mm
Registration to circuit +/-250 um
Registration score-to-score +/-150 um
11 Inspection Visual IPC-A-600H Class2
Electrical Open / short, withstand
Mechanical precision ISO 2768 fine, med (standard), coarse
Burrs ISO 13715
Cross-out rate % or number required
12 Quality control First article inspection report Provided with first sample of each part number
Customer IQC Product specification (necessary to fix Nanotherm OQC criteria)
8D investigation report Provided where non-conformance to customer IQC or field returns are received
13 Drawings File format Gerber**of circuit and customer unit where panel perimeter contains features defined by the customer.

* UL marking is restricted to Nanotherm LC MCPCBs processed by manufacturing partners Spirit Circuits Ltd., Elvia Printed Circuit Boards Groupe, B.R.E.E SA or Asupi Enterprises (Shenzhan Xingxhiguang). In addition, the MCPCB must be:1.0 mm or thicker, 35-102 um copper, Electra Polymers EMP110W or Taiyo PSR 4000 LEW-3 solder mask, copper finish OSP, ENIG, ENIPIG, or IAG.

** Gerber drawings are required to manufacture. They should be inside a .rar archive with standard file extensions:

Top copper
pcbname.GTS Top solder mask
pcbname.GT0 Top silkscreen / ident
pcbname.GBL Bottom copper
pcbname.GBS Bottom solder mask
pcbname.GBO Bottom silkscreen / ident
pcbname.TXT Hole and slot location and dimensions
pcbname.GML / GKO Board outline

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From Inquiry to Delivery 

1 Inquiry (we can design or assist in you PCB based on an electrical schematics)
Please provide as much information as possible about your product and requirements
  • Drawing(s) or description of required shape (gerber data, fabrication notes, array drawings and any special notes with requirements)
  • Operating Conditions / Application (Please provide as much information as possible)
  • Quantity
  • Delivery Request
  • Other requests or issues
2 Proposal / Quotation 
We will provide you with our proposal for a product that meets your requirements
Quote feedback: max 2 working days
3 Purchase Order
Production will begin according to the agreed-upon specifications and terms
4 Production
Sample lead time: 1 week, quick turn in 24h possible in EU plant
Producttion lead time: most orders can be delivered in 2-3 weeks depending on the complexity and volume
5 Delivery